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AM29LV 5604B 0SERI 1205D 74000 248YF C6707 APT20
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To Download LHRF3330-HV12-PF Datasheet File

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  a - 2015 15 -may. lhrf3330/hv12-pf ligitek electronics co.,ltd. property of ligitek only lhrf3330/hv12-pf high voltage led lamps data sheet doc. no : qw0905-: rev : date : lead-free parts pb l dcc
note : 1.all dimension are in millimeter tolerance is if ligitek electronics co.,ltd. property of ligitek only lhrf3330/hv12-pf part no. page 1/6 vcc-vf if= vf rl rl=1200ohms
630 domi -nant wave length ?
part no.lhrf3330/hv12-pf 60 50 2.5 1.5 00.5 700 1.0 650 0.5 0.0 550600 wavelength (nm) r e l a t i v e i n t e n s i t y @ 2 0 m a fig.5 relative intensity vs. wavelength page 3/6 ligitek electronics co.,ltd. property of ligitek only 1000 100 10 forward current(ma) 2.0 1.0 0.0 1.0 r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a fig.2 relative intensity vs. forward current 40 hrf chip 20 10 3.0 0 1.02.0 30 f o r w a r d c u r r e n t ( m a ) typical electro-optical characteristics curve fig.1 forward current vs. forward voltage forward voltage(v) 80 2.5 2.0 1.0 1.5 2060 40 -20 0 0.0 6080 0.5 r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5
60 seconds max page 4/6 2.wave soldering profile soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 150 time(sec) 260 260 100 50 preheat 120 25 0 0
page 5/6 this test intended to see soldering well performed or not. the purpose of this test is the resistance of the device under tropical for hours. this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. solderability test 1.t.sol=245
l w l w h packing specification 1. 500pcs / bag 2. 8 bag / inner box size : l x w x h 33cm x 19cm x 8cm h c/no: made in china 3. 12 inner boxes / carton size : l x w x h 58cm x 34cm x 34cm i t e m n o . q ' t y : p c s n , w , : k g s g , w , : k g s 6/6 page


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